cei.jpg (4061 bytes)

Circuit Electronic Industries
Public Co., Ltd.
(CEI)

Process Flow

CEIWaferMnt.jpg (6718 bytes)

Wafer Mount
Semi-automatic
contactless mounter.
Vacuum mount, no roller.
Bubble-free mounting.

Wafer Saw
Deionized (DI) Water.
CO2 Bubbler (optional).

CEISaw.jpg (5782 bytes)
CEIDieAttach.jpg (6788 bytes)

Die Attach
Silver epoxy.
Auto die attach for single
or multi-chip products.
Soft solder with void control.

Wire Bond
Cratering test to
ensure bond quality.
Low loop control.

CEIWireBond.jpg (6862 bytes)
CEIMold.jpg (6634 bytes)

Mold
Real-time X-ray
to check setup.

Wet Media Deflash
Chemical-free wet media blazing for package and lead-frame surface.

CEIWetDeflash.jpg (6370 bytes)
CEIDeflash.jpg (6310 bytes)

Deflash, Trim, Form
Automatic pick-and-place on tray to maintain co-planarity.

Open/Short Test
Verify internal wiring per
customer requirements.

CEIOSTest.jpg (6421 bytes)

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