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Circuit Electronic Industries
Public Co., Ltd.
(CEI)

Request a package and lead frame drawing 
Die paddle sizes by package type

Available Packages

Package Type

Body Size

Lead Count

P-DIP

300 mil

8, 14, 16, 18, 20, 24

600 mil

24, 28, 40

PLCC

Square

20, 28, 44, 68

SOIC

150 mil

8, 14, 16

300 mil

16, 18, 20, 24, 28

PQFP

14 x 20 x 2.7 mm

64, 80, 100

TQFP

10 x 10 x 1.4 mm

44, 64

7 x 7 x 1.0 mm

32

TSSOP

3.0 mm W, 0.65 mm pitch

8, 10

4.4 mm W, 0.65 mm pitch

20, 24, 28

4.4 mm W, 0.50 mm pitch

38

QSOP

0.153" x 0.390" x0.055"

28

0.153" x 0.192" x 0.055"

16

QFN/MLF/PLLP (lead-less)

3 x 3 mm

6, 12 & 16

4 x 4 mm & 4 x 5 mm

16, 20 & 24

5 x 5 mm

28 & 32

6 x 6 & 7 x 7

40 & 44

SSOP

5.3 mm W, 0.65 mm pitch

28

SIP

0.430 x 0.785 x 0.177"

11

SOT-89

0.095 x 0.177 x 0.060"

3

SOT-223

0.138 x 0.255 x 0.063"

4

TO-220

0.410 x 0.355 x 0.175"

2, 3, 5

TO-263

0.410 x 0.355 x 0.175"

2, 3, 5

TO-3P/TO-247

0.630 x 0.830 x 0.195:

2, 3, 5

TO-3/TO-46/TO-56
TO-8/TO-39/TO-52

Metal Can

2-12

Thermal Enhancement Packages (TEP)

Package Type

Body Size

Lead Count

TEP SOIC

150 mil

8, 16

300 mil

16

TEP QSOP

150 mil

16, 28

TEP TQFP

10 x 10 x 1.4 mm

44, 64

TEP PQFP

14 x 20 x 2.7 mm

64, 80, 100

Current as of April 18, 2005

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