Public Co., Ltd.
Simple five minute changeover of wafer size and grind specification.
Operator friendly menu format to guide operator through programming sequence.
Programmable single or dual grind modes maximize efficiency and surface finish.
Closed loop feedback for consistent wafer thickness control.
Feed Wafers: 3" to
to 0.050" thick
Finished Thickness: 0.005" to 0.045"
Pricing is determined by wafer size, amount of material to be removed,
and the number of wafers per week.